News and Events

News and Events



Technic launches Auroguard NP-12, new post-treatment process for reduced gold use in electronic connectors.
Technic Releases New Barrier Layer Coatings to Enable Reduced Gold Consumption in Electronic Applications
Technic Launches Enhanced White Flexible Solder Mask for LED Applications – TechniFlex LCL 1000F/900
Technic to Host New England Sector of the Electrochemical Society Lecture by Andrzej Lasia
Technic to Launch New Line of Process Chemistries for Reduced Gold Consumption in Electronic Applications
Technic Releases Black Pad Resistant Electroless Nickel
Technic Engineered Powders Completes Analytical Laboratory Renovations
Technic releases Technistan HTM 4089 New High Throw, Low Cost Tin Process
Technic Introduces Pallaspeed Pd/Ni NFA - Low Stress Palladium Nickel
Electropolishing Systems from Technic Provide Precise Control and Repeatability
Technic and STS Switzerland announce joint agreement
Technic Engineered Powders Appoints Ionel Halaciuga PhD - Research & Development Director
Technic Appoints Felix Schwager Research & Development Director
Technic Releases Higher Efficiency, Reduced Silver Process for Solar Cell Production
Technic Appoints Wilson Xia Technical Director of PV Products / Asia Pacific Region
Korea Technic Announces Official Opening of New Manufacturing Facility
Technic launches updated website with expanded content
Technic and University of Albany Nanocollege Launch Partnership to Enable Innovative Process for Solar Cell Manufacturing
Technic Shares in Production of 2010 Winter Olympic Medals
Technic Appoints Anthony Gallegos as Global Product Manager for Solar and Semiconductor Technology
Technic announces purchase of reel to reel assets of Metfab Technologies, Inc.
Technic announces purchase of Control Engineering Division of Metfab Technologies, Inc.
Technic introduces new Tin-Silver alloy electroplating process
Technic appoints Lynne Michaelson Ph.D. as Senior Materials Scientist
Technic announces a new high speed copper for semiconductor applications to eliminate wafer bowing
Technic expands Corporate Offices to new facility.