Technic Solar Chemistry

Technic Solar Chemistry



Technic, a leader in the electronics industry, has developed a full line of specialty products specifically designed for advanced solar cell metallization.

TechniSol-a new dawn for solar


RSP

(Reduced Silver Paste)

RSP Technology lowers cost and improves performance by reducing the amount of silver paste that is used to form the front side metallization by electrodepositing a plated silver layer on top of a thin silver paste contact layer.


ASL

(Alternative Seed Layer)

ASL Technology gives the cell manufacturer the ability to lower front side metallization material costs by up to 40% and improve efficiencies. ASL enhances metallization through the use of a nickel seed layer with Light Induced Plating of nickel, copper and tin. ASL will be released for high volume manufacturing in 2011.


Technic maintains a strong commitment in the development of new solutions for the photovoltaic industry. Combined with our state of the art advanced processing equipment, Technic is a knowledgeable and reliable partner for next generation PV cell manufacturing.


TechniSol Ag 2460

TechniSol Ag 2460 is a non-cyanide silver electrodeposition process used to enhance a silver paste seed layer or used as a solderable layer in a solar cell metal stack application. Ag 2460 is a high-speed, low-silver metal formulation that provides a very fine grain morphology, excellent thickness distribution and zero lateral growth. Can be used with Light Induced Plating or conventional electroplating.

    TechniSol Ag 2460 Benefits:

  • Clear solution allowing for maximum light transmission
  • Fully analyzable and easily controlled
  • Wide process window
  • High stability and extended bath life
  • High deposition rate
  • Formulated for silver paste compatibility

Another major benefit of the TechniSol Ag 2460 is that the bath is not consumed through electrolysis. This bath is only consumed through drag-out. With a running concentration of as low as 20 g/l, the TechniSol Ag 2460 offers a very cost effective electrodeposition system.


TechniSol Cu 2440

TechniSol Cu 2440 is an electrodeposition copper process that can be used with Light Induced Plating or conventional electroplating. This bath produces low stress, high conductivity deposits at 40 – 60 ASF that are ideal for use in a solar cell metal stack application.

TechniSol Ni 2420

TechniSol Ni 2420 is an electrodeposition nickel process that can be used with Light Induced Plating or conventional electroplating. It is ideal for use as a barrier layer over alternative seed layers such as nickel silicide and Laser Doped Selective Emitter. Produces a low stress, low resistivity nickel deposit..