Loose Connectors (CDP-2000)

CDP-2000 Controlled Depth Pin Plater


Technic's CDP-2000 is a precision electroplating machine designed for high accuracy controlled depth precious metal plating onto loose parts, typically for pins and sockets for the electronic connector industry. Considering that only a small area at the end of the part needs to be electroplated, tremendous savings can be realized when compared with conventional plating methods.


Parts may include:


  • Electrical connector pin and socket components
  • Spring plunger contacts
  • Terminal posts
  • Or any other pin/cylindrical shaped objects manufactured as single components.


    • Transport belts available with permanent inserts or removable cartridges depending on the volume and required flexibility.
    • Dual processing lanes can be configured with the same or two different component configurations. Common chemical reservoirs supply process cells in each lane.
    • Plating cells utilize precision fluid flow and level controls to produce controlled depth repeatability to within 0.5mm.
    • Menu driven computer reconfigurable anodes provide plating flexibility for a variety of part types including difficult to plate parts requiring high throw into internal recesses.
    • Contact roller connects cathode current to transport belt, providing noise-free low resistance electrical contact with minimal drag and no particle generation.
    • Plating cells utilize a synchronized backup conveyor, which provides pressure on each part through the cells for reliable cathode electrical connection in transport belt.


    • High, medium, or low volume production - Plated component throughput of 1000-20000 parts per hour
    • Rapid payback with up to 70% gold savings over conventional barrel plated parts
    • Unique plating cell and sparging design provides accurate and repeatable plating depth control and consistent part to part thickness uniformity
    • Plating cell eliminates the ‘brown ring’ at the demarcation line between controlled depth deposit and base deposit.


    Manual or fully automatic, in-line or off-line loading and unloading of parts is available. Automation is accomplished using various technologies including:

    • Vibratory bowl feeders
    • Inline conveyor
    • Scara robot
    • Cassette-to-cassette


    Data presented here is the summary data from an actual case study demonstrating Gold & Dollar savings achievable when using the CDP-2000 versus barrel plating of connector sockets and pins. Plating thickness profiles used for the calculation of savings are averages of a 20 piece sample size taken from a 200 part run for both the parts.

    Gold Savings for Pin

    • 50m” overall barrel plate*
    • 1.2 gm/1000 parts
    • Selective plate + Au flash remainder
    • 0.54 gm/1000 parts
    • Gold savings of 0.66 gm/1000 parts, 55%
    • 660 gm or 21 troy oz of Au for 1 million pins
    • $16,800 at $800/troy oz Au

    Gold Savings for Socket

    • 50m” overall barrel plate*
    • 2.16 gm/1000 parts
    • Selective plate + Au flash remainder
    • 0.69 gm/1000 parts
    • Gold savings of 1.47 gm/1000 parts, 68%
    • 1470 gm or 47 troy oz of Au for 1 million pins
    • $37,600 at $800/troy oz Au

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