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| SEMCON™
1000 Manual Wet Bench |
| TECHNIC's
SEMCON™ 1000 manual wet bench is a smaller
version of SEMCON™ 2000 designed specifically
for the purposes of the research and development
markets in university research and small company
laboratories. The system is capable of processing
most patterned wafers with uniform plating distribution
and it has the same basic cell design features as
the SEMCON™ 2000 system, at a significantly
lower cost. |
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| SEMCON™
2000 Manual Wet Bench |
TECHNIC's
SEMCON™ 2000 manual wet bench is the latest
generation of dependable, wet bench style, multiprocessing,
electroplating tools which are capable of processing
wafers and other substrates ranging from sizes
of 50mm to 300mm. |
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| SEMCON™
3000 Automatic Wet Bench |
| TECHNIC's
SEMCON™ 3000 automatic wet bench is capable
of processing a large variety of wafer sizes ranging
from 50mm to 200mm. The system is designed to meet
Semi Standards S2-0200 and the inline system means
no lifting out and over of wafers from one process
station to another, therefore significantly reducing
chemical loss and drag-out. |
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Equipment
capabilities: |
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SEMCON
1000 Manual wafer plating system for research laboratories
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SEMCON
2000 Manual wafer plating system |
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SEMCON
3000 Automatic wafer plating system |
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Reel
to reel continuous leadframe and spot plating systems |
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Cut
strip leadframe plating systems |
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"E"
Class enclosed hoist plating systems for "clean room"
environments |
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Precious
and non-precious metal recovery systems |
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Support
and auxiliary equipment, including accumulators, cassette,
magazine and other specialty loading and unloading systems |
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