TechniPad SMT

Electroless Nickel Immersion Gold

The TECHNIPAD SMT Process is an advanced electroless nickel / immersion gold (ENIG) process that has been specifically developed to meet the challenges of selective plating of printed circuit board features. The TECHNIPAD SMT Process incorporates a mid-phosphorous electroless nickel (8 — 10% w/w) with a replenishable, non-porous immersion gold. The TECHNIPAD SMT System meets all the requirements for solderability and low contact resistance applicable to a thin (2-4 u”) gold deposits.

Technic EN AT 5600

Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper. Lateral growth yields a flatter surface with less pronounced grain boundaries instead of the typical nodular, “cauliflower-like” structure from older formulas. This is important, because the grain boundaries are where corrosion products initiate and under worst case conditions become black pad. These corrosion products make soldering more difficult and can cause wetting and adhesion problems in assembly. By providing a flatter surface, TechniPad SMT with the Technic EN AT 5600 is the only process that provides a substantially better surface to solder to.

The TECHNIPAD SMT System meets the following criteria:

• IPC S-Std-052
• IPC J-Std-003 Category 2
• Mil-Std-202 Method 208
• Mil-Std-26074B
• AMS 2405
• Aluminum Wire Bonding
• Meets all SMT Pad Co-planarity requirements

The TECHNI PAD SMT System has been fully characterized and optimized for printed circuit board production to guard against common defects associated with ENIG, such as nickel foot, skip plate and black pad. This optimization is a result of worldwide field experiences with the TECHNIPAD SMT chemistry. Developed with a system approach, the individual process steps of the TECHNIPAD SMT System are controlled to give consistent deposit characteristics. The entire system has been design to insure maximize efficiency and cost savings from cleaning and activation through electroless nickel and immersion gold processes.

TechniPad ENEPIG

Electroless Nickel Electroless Palladium Immersion Gold

Addition of electroless palladium to the ENIG process improves solder joint strength and allows for gold wire bonding. The TechniPad ENEPIG process provides a stable electroless palladium chemistry capable of depositing over 30 microinches of Pd. TechniPad ENEPIG, by providing thicker palladium deposits, improves the process window for wire bonding and low contact resistance for touch contacts.

Argentomerse NC

Immersion Silver

Unlike most immersion silver processes on the market, the Argentomerse NC Process is both cyanide and nitrate-free. It will deposit approximately 0.125 microns (5 uin) of silver per minute on copper and copper alloys. Argentomerse NC is slightly alkaline and, unlike acid processes, the deposition of silver from Argentomerse NC is controlled, yielding more uniform silver thicknesses over a wide range of PCB designs. Argentomerse NC has a wide tolerance for chloride and does not require a pre-dip or DI water rinsing prior to the immersion silver bath.

Leveltech

Immersion Tin

Leveltech is a direct alternative to HASL and ENIG that deposits a thickness of 0.7 – 1.0 micron of planar tin. The deposit is ideal for subsequent soldering and will withstand up to three thermal cycles. The unique metallic additive helps to produce a dense, fine crystalline deposit and reduces the possibility of whiskering. Leveltech is the ideal process for surface mount and press fit assembly applications.