| TECHNIC
Suzhou Semiconductor Engineering Co. Ltd and TECHNIC Asia
Pacific Engineering Ltd |
| TECHNIC's
Main Types of Plating Services |
| Existing
Plating Services |
| Semiconductor
Tin-Lead Plating |
|
Semiconductor Lead Free Plating |
| |
| Future
Plating Services |
|
Nickel Plating |
| Gold
Plating |
|
Palladium Plating |
| Semiconductor
Lead Frame Silver Plating |
|
TECHNIC performs plating services on lead frames (above)
|
| |
|
| About
TECHNIC's Plating Services |
| Speed
of plating is performed at 6-10 meters/min. |
| Turnover
time for Technic's plating services is 6-8
hours. |
| X-ray
Fluorescent Thickness Measurement system is used
to determine the thickness and alloy composition
of plating deposits. |
|
 |
| High
quality plated lead frames (above) are produced. |
The
plating services are performed
by TECHNIC's reel-to-reel plating
machine and strip-to-strip lead
frame plating machine (Top). |
| TECHNIC
Suzhou - Quality System Certification |
|
|
|
